FIELD: procedures for soldering aluminum without using solder.
SUBSTANCE: method is realized with use of composition containing, mass %: fluosilicate of alkali metal, 2 - 98; and fluosilicate of aluminum, 2 -98. In addition said composition may contain aluminum powder in quantity 1 - 54 mass %. It is possible to use composition in content of ready mixture having organic dissolving agent and additional matters. Composition may contain as fluosilicate of alkali metals, potassium and(or) rubidium fluosilicate and(or) cesium fluosilicate and(or) lithium fluosilicate and(or) their mixtures.
EFFECT: effective and reliable soldering of parts of different configuration and thickness.
10 cl, 3 ex
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