METHOD OF SOLDERING OF ALUMINIUM AND ITS ALLOYS AND MATERIAL FOR SOLDERING OF ALUMINIUM AND ITS ALLOYS Russian patent published in 2008 - IPC B23K1/19 B23K35/02 B23K103/10 

Abstract RU 2333082 C2

FIELD: technological processes.

SUBSTANCE: for soldering foil is used from aluminium or its alloys that are not solders, with thickness of 5-50 micrometer, on which from one or both sides composition is applied with layer thickness of 5-50 micrometer, which consists of alkaline metal fluorine-silicate, aluminium fluoride, fluorine-aluminate of alkali metal, aluminium powder and binder. Assembly is heated until foil melts down with formation of solder layer between soldered surfaces in the form of silumin and flux and then cooled down.

EFFECT: inventions allow to simplify preparation of parts from aluminium or its alloys for soldering and to increase quality.

10 cl, 1 tbl

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RU 2 333 082 C2

Authors

Poltorybat'Ko Andrej Valentinovich

Shaklein Denis Anatol'Evich

Zadov Vladimir Efimovich

Dates

2008-09-10Published

2006-05-10Filed