METHOD FOR INTERCONNECTING MICROSTRIP BOARDS Russian patent published in 2007 - IPC H01Q1/38 H01P3/08 H05K1/14 

FIELD: radio-electronic engineering including radio equipment manufacture.

SUBSTANCE: proposed method for interconnecting microstrip boards includes their mechanical junction, filling of gaps formed in the process with composition incorporating grade B silicone rubber, catalyst K 68, and capacitor titanium dioxide followed by exposure of joined microstrip boards to room temperature for minimum 2 h.

EFFECT: reduced microwave energy loss and standing wave ratio at junction point of microstrip boards.

1 cl, 2 tbl