FIELD: glass industry.
SUBSTANCE: invention relates to compositions of soldering glasses used in electronics. Proposed glass comprises the following components, wt.-%: SiO2, 10.0-14.0; Al2O3, 40.0-50.0; CdO, 10.0-20.0; ZnO, 1.0-2.0; CuO, 12.0-15.0, and Na2O, 12.0-14.0. Invention provides enhancing value of the coefficient of linear thermal expansion of glass.
EFFECT: improved and valuable property of glass.
1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| GLASS | 2006 |
|
RU2320551C1 |
| ENAMEL | 2006 |
|
RU2315018C1 |
| GLAZE | 2006 |
|
RU2322412C1 |
| ENAMEL | 2006 |
|
RU2323900C1 |
| GLASS | 2006 |
|
RU2317952C1 |
| GLAZE | 2006 |
|
RU2309914C1 |
| DECORATIVE COATING | 2006 |
|
RU2345965C2 |
| GLASS | 2006 |
|
RU2318741C1 |
| GLASS | 2006 |
|
RU2311353C1 |
| GLASS | 2006 |
|
RU2317953C1 |
