FIELD: polymer materials.
SUBSTANCE: invention relates to polymer compositions based on unsaturated polyester resins utilized to obtain filling, impregnation, and molding materials widely employed in manufacture of products in electronic and radio industries, in automotive industry, in construction, and other areas. Composition according to invention contains, wt parts: unsaturated polyester resin 100, epoxide dian resin 50-100, aliphatic amine 18-20, and hexachloro-p-xylene 2.0-2.5. If needed, composition may further contain filler up to 250 wt parts and/or special-destination additives up to 10 wt parts.
EFFECT: improved strength characteristics and enabled hardening in absence of toxic and explosive peroxide compounds.
3 cl, 3 tbl, 10 ex
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Authors
Dates
2008-01-27—Published
2006-08-31—Filed