FILM PHOTORESIST FOR STENCILING AND METHOD FOR ITS MANUFACTURE Russian patent published in 2008 - IPC G03F7/04 G03C1/72 C07C335/02 C07C337/06 

FIELD: technology for manufacturing film photoresist and grid-stencil screens based on it, used in production of electronic boards, ceramic cases for integration chips, polygraphic industry products.

SUBSTANCE: film photoresist for stenciling is claimed, which contains a flexible substrate and polymeric copy layer which may be sensitized based on film-forming composition, which includes a polymeric binding agent, which contains polyvinyl spirits and copolymer of vinyl acetate with 2-50 mol. % of dialkyl maleate (C₂-C₈) or with 2-95 mol. % of ethylene, or polyvinyl acetate, a colorant belonging to the class of phthalocyanine pigments or triphenylmethane dyes, non-ionogenic penetrating agent from the class of polyethylene glycol ethers of mono- and dialkyl phenols or bis(octaglycerol)-2-alkenesuccinate, and additionally - activator, selected from a group which includes compounds, containing thiocarbonyl group, such as thiocarbamide and a row of its derivatives, salt of thiosemicarbazide, N,N-diethyldithiocarbamates of sodium and ammonium, thioacetamide, compounds with mercapto-group, for example, L-cysteine, sulfite compounds, such as pyrosulfites of potassium or sodium, formaldehyde-bisulfite of sodium, in amount of 0,1-2,0 mass.% in dry copy layer. Film photoresist is produced by spraying described water-based film-forming composition onto flexible polymeric base with following drying of sprayed layer by warm air.

EFFECT: increased photo-sensitivity of film photoresist, 1,5-2,0 times reduced time of exposition, increased resistance of stitched copy layer to effect of organic solvents, possible production of grid-stencil screens with protective layer of increased thickness (over 100 micrometers) on basis of the photoresist.

2 cl, 2 tbl, 14 ex