FIELD: dry-film photoresists. SUBSTANCE: dry-film photoresist consists of polyethylene terephthalate substrate and photopolarized layer. The latter includes, mas.p.:(a) film-forming component 80-120; (b)acrylic monomer 25-60; (c)photoinitiator 3-10; (d) inhibitor 0.005-0.2; (e) dye 0.03-0.3; (f) plasticizer 5-15. Used in the capacity of the above components are (a) styrene copolymer, methyl methacrylate copolymer and acrylonitrile copolymer with molar link ratio of 37:50:13, and mol.wt of 56000-112000; (b) triethylene glycol dimethacrylate and/or dimethacrylate bis-(ethylene glycol)phthalate with mixture ratio of 1:1; (c) mixture of benzophenone with 4,4-bis-(dimethylamino)benzophenone with mass ratio of 1-6:1; (d) hydroquinone or n-metoxyphenol, or bisalcophen; (e) one of fat-soluble anthraquinone dyes: green C.I.No.61565; blue C.I. No.61525; violet C.I.61705; or basic green I C. I. No. 42040, or phthalocyanine green pigment C.I. No.74260; (f)dioctyl-(sebacate)adipate or dibutyl sebacate, or dibutyl ether tris-(diethylene glycol)tetradipate. Stability of film photoresist is 6-7 min; adhesion 529-571 gf/cm. EFFECT: higher stability of film photoresist in hot heat carrier of Laprol-2502-OZh type and increased adhesion to substrate. 10 tbl
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Authors
Dates
1995-04-20—Published
1985-09-25—Filed