FIELD: heat-curable sealing compositions.
SUBSTANCE: composition is proposed, containing the following mass components: 100 (meth)acrylic monomer or its mixture with an allyic monomer, 0.5-2.5 initiator, 0.01-0.32 hydroquinone, 0.01-0.13 2,2,6,6-tetramethyl-4-oxopiperidine-1-oxyl, 0.004-0.05 disodium salt of ethylenediaminetetraacetic acid, 20-125 filler and 5-30 functional additives. The proposed composition has polymerising activity at 100-250°C for 3-8 minutes and breaking stress of 605-15.5 MPa. This adhesive strength is sufficient for withstanding steam pressure of up to 4 MPa. Use of the proposed composition allows for repairing steam pipes with constant supply of steam.
EFFECT: design of a heat-curable sealing composition for repairing steam pipes without interruption of steam supply.
1 cl, 1 tbl, 5 ex
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Authors
Dates
2008-06-27—Published
2007-04-16—Filed