FIELD: metallurgy.
SUBSTANCE: invention refers to galvanic technology and can be applied in various branches of industry where materials with low transient electric resistance are required. Electrolyte contains, g/l: gold-hydrochloric acid (in terms of metal) 8-12; potassium ferrocyanide 150-200; potassium sulphate 40-50; potash 40-50; salt of anion polyhedral borate of common formula MzCnBmHx, where M is sodium, potassium or ammonium, z=1, n=0, 2, m=3, 9, 10, 12 x=8, 10, 12 -1.0-2.1.
EFFECT: reduced transient electric resistance.
2 tbl, 1 ex
| Title | Year | Author | Number |
|---|---|---|---|
| ELECTROLYTE FOR SEDIMENTATION OF ALLOY AURUM-BORON | 2008 |
|
RU2362841C1 |
| ELECTROLYTE FOR DEPOSITION OF NICKEL-BORON-FLUOROPLASTIC COMPOSITE MATERIAL | 2002 |
|
RU2213812C1 |
| ELECTROPLATING NICKEL-BASE COMPOSITE MATERIAL | 2002 |
|
RU2213813C1 |
| ELECTROLYTE FOR ALLOY DEPOSITION ON THE BASIS OF SILVER AND ANTIMONY | 0 |
|
SU1798387A1 |
| ELECTROLYTE FOR DEPOSITION OF COMPOSITION NICKEL-FLUOROPLASTIC COATING | 2005 |
|
RU2297476C1 |
| ELECTROLYTE FOR SEDIMENTATION OF COMPOSITION COATING NICKEL-COBALT-DIAMOND | 2008 |
|
RU2362843C1 |
| ELECTROLYTE FOR SEDIMENTATION OF COMPOSITE COATING NICKEL-BORON-ALUMINIUM OXIDE | 2009 |
|
RU2418106C2 |
| ELECTROLYTE FOR PLATING AU-CU ALLOY COATINGS | 0 |
|
SU859486A1 |
| GALVANIC ALLOY ON SILVER-BASE | 0 |
|
SU1770430A1 |
| ELECTROLYTE FOR DEPOSITING NICKEL-BORON ALLOY COATINGS | 1997 |
|
RU2113554C1 |
