METHODS AND SYSTEMS OF MICROPROCESSING Russian patent published in 2010 - IPC B41J2/16 

FIELD: printing industry.

SUBSTANCE: in method for arrangement of slot for supply of ink into semiconducting substrate for jet printing head, the first structural element is formed by means of multiple application of electric energy discharge to the first side of semiconducting substrate or by means of abrasive material application on the first side of semiconducting substrate, vibration is imparted to tool opposite to the first side, besides tool vibrates with a certain frequency and at a certain distance from the first side for formation of the first structural element, material of semiconducting substrate is removed from the second side for formation of the second structural element, besides at least part of the first and second structural elements crosses for formation of slot for ink feed, which passes through semiconducting substrate, and for removal method is used, which has been selected from group, including wet etching, dry etching, laser treatment, sand drilling, treatment with abrasive jet, rotary-vibration drilling, cutting with saws and mechanical treatment in machines.

EFFECT: fast formation of slot for ink feed in semiconducting substrate for jet printing head with low costs.

19 cl, 14 dwg