FIELD: process engineering.
SUBSTANCE: fluid ejecting head comprises ejecting element silicon substrate with one surface provided with generator of power for fluid ejection and substrate support. Proposed method consists in that pitch composition to be cured on heating is placed between said substrate and support element so that portion of rear surface of substrate one surface comes in contact with both sides of support element. Then, light comprising at least ultraviolet rays and infrared rays is emitted onto said pitch composition from the side of ejecting element substrate through silicon plate to cure said composition.
EFFECT: higher printing quality of said head.
8 cl, 5 dwg
