METHOD OF FORMING 3D MICROSTRUCTURES OF ENGRAVING PATTER IN FUNCTIONAL LAYER OF INTAGLIO PRINTING DIE FUNCTIONAL LAYER AT COMPUTER-AIDED ENGRAVING HARDWARE-SOFTWARE COMPLEX Russian patent published in 2012 - IPC B23P15/00 B41C1/00 

FIELD: process engineering.

SUBSTANCE: proposed method comprises two stages of machining, at least, one 3D microstructure by cutting to remove functional layer of said microstructure. At first stage, cutting is made by high-speed milling. Note here that conical milling cutter is used to remove main part of functional layer material with allowance for finishing retained. At second stage, machined surface is subjected to single or twofold indenting. Note that functional layer material is removed with the help of polyhedral, primarily, trihedral pyramidal cutting tool, every side of which making tool front surface, while tool replacement is carried pout automatically. Said finishing is made in one pass along the microstructure contour by planning at second stage. Note here that first and second stages are performed by aforesaid one tool.

EFFECT: better milling performances.

6 cl, 10 dwg