FIELD: metallography, possible use for making sub-micron (nanometer) relief structures in functional layers of metallographic forms.
SUBSTANCE: in accordance to invention, method is realized by means of multi-pass processing of functional layer of product by cutting. In places of connection of contour parts of projection being formed with different (relatively to base system of coordinates) angular orientation, bisector grooves are cut in direction towards strippable stock. Then side faces of pattern fragment projection are formed. During that on one of technological transitions contouring of aforementioned projection along perimeter is performed (at least one the side of one of faces being formed) by forming a groove along appropriate projection rib with depth lesser than given height of projection. After that stock remaining between projection elements is removed with creation of its given profile without violation of integrity of section of face formed during contouring. Removal of stock remaining after contouring is performed in two stages. During first stage (equidistantly to the groove made during contouring process) a groove is cut with depth equal to given height of projection. During creation of this groove, cutting edge of tool (defining the projection face) is moved towards strippable stock for value limited by technological processing tolerance, to prevent contact of this cutting edge with section of projection face formed during contouring process. During second stage remaining stock is removed by means of successive passes of tool in zone which is limited by the groove formed during first stage.
EFFECT: increased efficiency.
13 cl, 3 dwg
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Authors
Dates
2007-05-27—Published
2001-12-10—Filed