FIELD: chemistry.
SUBSTANCE: invention relates to novel benzoxazine siloxanes of general formula 
, where R1 denotes trimethylsilyl, dimethylsilylpropyl-8-methoxy-N-R2-1,3-benzoxazine, pentamethylsiloxypropyl- N-1,3-benzoxazine; R2 denotes alkyl C1-C4, hydroxyethyl, phenyl; X denotes oxygen, methylene, isopropyl, hexafluoropropyl; m=0-8, n=0-32; at certain conditions, values of X, R1 and number links in benzoxazine siloxanes. Heat-curable compositions for heat-resistant adhesives, filling compounds and coatings are obtained from the benzoxazine siloxanes and epoxy resins. The composition contains (pts.wt) one or seven benzoxazine siloxane compounds in amount of 10-50; epoxy-diane or epoxy-phenol-formaldehyde resin in amount of 100-50; a curing agent - isomethyl tetrahydrophthalic anhydride in amount of 0-83; filler - boron or aluminium nitrides in amount of 0-15.
EFFECT: coatings and adhesives obtained based on the invention withstand high thermal action.
2 cl, 3 tbl, 18 ex
| Title | Year | Author | Number |
|---|---|---|---|
| HYDROXYMETHYLOLPHENYL-ORGANOSILOXANES AND SYNTHESIS METHOD THEREOF | 2009 |
|
RU2397994C1 |
| N,N-DIMETHYLAMINOMETHYLATED AROMATIC SCHIFF BASES AS HARDENING ACCELERATOR OF EPOXY RESINS, AND METHOD OF PREPARING THEREOF | 1997 |
|
RU2134259C1 |
| BENZOXAZINE COMPOUNDS, FIRE-RESISTANT PHENOLPHTHALEIN DERIVATIVES AND METHOD OF SYNTHESISING SAID COMPOUNDS | 2005 |
|
RU2386632C2 |
| BIS-N,N-DIMETHYLAMINOMETHYLATED AROMATIO SCHIFF BASES AND METHOD OF PREPARATION THEREOF | 1998 |
|
RU2161603C2 |
| FIRE RETARDANT CATALYST FOR PRODUCTION OF POLYMERIC MATERIALS BASED ON POLYBENZOXAZINES, COMPOSITIONS WITH ITS USE | 2020 |
|
RU2756360C1 |
| THERMALLY HARDENED COMPOSITIONS BASED ON EPOXY RESINS, WHICH CONTAIN NON-AROMATIC UREAS AS ACCELERANTS | 2008 |
|
RU2491309C2 |
| CURABLE COMPOSITIONS CONTAINING BENZOXAZINE-EPOXY MIXTURE AND THEIR APPLICATION | 2016 |
|
RU2749037C2 |
| METHOD OF OBTAINING POLYAMINOALKYLPHENOLS | 0 |
|
SU1118635A1 |
| BENZOXAZINES AND COMPOSITIONS CONTAINING SAME | 2015 |
|
RU2702630C2 |
| THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | 2009 |
|
RU2528849C2 |
