CAMERA MODULE AND IMAGE-FORMING APPARATUS Russian patent published in 2013 - IPC G03B17/00 H04N5/225 

FIELD: physics.

SUBSTANCE: first end 44 of a lens carrier 22 and its second end 46 intersect. An image sensor is placed such that its back surface is directed towards a flexible substrate. A signal processing module is formed on a solid printed-circuit board 32. The flexible substrate 28 has a protruding area 50 which protrudes from the intersection part where the first end 44 and the second end 46 intersect. The printed-circuit board 32 lies on the second end 46 through a temporary fixing device 54. The protruding area 50 of the flexible substrate 28 is laid in the intersection part 48; a socket 52 on the side of the flexible substrate is connected to a socket 56 on the side of the printed-circuit board, and an adhesive layer 58 is connected to the second end 46. As a result, the flexible substrate 28 and the printed-circuit board 32 are mounted in the lens carrier 22.

EFFECT: reduced voltage applied to sockets and the flexible substrate when mounting the printed-circuit board.

9 cl, 9 dwg