FIELD: electrical engineering.
SUBSTANCE: invention is referred to assembly of light-emitting diode (LED) lead-frame unit, LED group using this lead-frame unit and method for manufacturing of LED group. Assembly of lead-frame unit contains: heat-dissipating base; variety of electrodes located around heat-dissipating base; insulating supporting unit which surrounds and heat-dissipating base and variety of electrodes thus connecting heat-dissipating base with variety of electrodes; at least two collars formed along circumferential perimeter at the upper surface of insulating supporting unit and at least one annular groove formed between at least two collars; at that each of at least two collars contains sharp upper edge and inclined lateral sides.
EFFECT: easy manufacturing with low manufacturing costs of frame and LED group using this frame, capability for manufacturing of LED group where light is emitted by luminiferous material to LED matrix and is absorbed there thus reducing absorption losses.
24 cl, 9 dwg
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