FIELD: chemistry.
SUBSTANCE: invention relates to curing agents for epoxy resins and compositions based thereon. Disclosed is a method of producing an organosilicon curing agent for medium-molecular weight epoxy resins by reacting, for 2-3 hours at temperature of 80-100°C in the presence of an alkaline catalyst, an amine-containing organosilicon compound (I), an organosilicon compound with a phenyl group at the silicon atom (II) and an organosilicon compound containing two methyl groups at the silicon atom (III) with molar ratio of components I:II:III = 1.0:(0.5-1.0):(0.5-2.0) and total content of alkoxy groups to the total number of silicon atoms of 1-1.5.
EFFECT: simple method of producing organosilicon curing agents that are stable during storage, which enable to obtain paint coatings with good adhesion to different substrates and improved physical and mechanical properties.
1 cl, 3 tbl, 14 ex
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Authors
Dates
2014-03-20—Published
2013-01-31—Filed