ADHESIVE COMPOSITION WITH NANOMODIFIER FOR CHIPBOARD PANELS Russian patent published in 2014 - IPC C09J161/00 B82B3/00 

FIELD: chemistry.

SUBSTANCE: adhesive composition with a nanomodifier for chipboard panels contains a binding agent based on a thermosetting resin, a hardening agent and the nanomodifier in the form of a nanodisperse schungite powder in an amount from 1% to 20% of the weight of the binding agent. Particles of nanodisperse schungite have dimensions which do not exceed 100 nm, and are distributed in the binding agent based on a carbamide formaldehyde resin with weight part 79-95%. Weight part of the hardening agent, ammonium chloride, is 1%.

EFFECT: adhesive composition increases the tensile strength of the panel, reduces the panel swelling in case of moistening.

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