ADHESIVE COMPOSITION FOR MANUFACTURING CHIPBOARDS AND WOOD PRODUCTS Russian patent published in 2018 - IPC C09J161/24 C09J11/04 B82B3/00 B82Y30/00 B82Y40/00 

Abstract RU 2642568 C2

FIELD: chemistry.

SUBSTANCE: adhesive composition contains components with the following ratio, wt %: binder urea-formaldehyde resin (97.41-98.36), a curing agent of ammonium chloride (0.64 to 1.59), an amorphous modifier of silicon dioxide (0.05-1.00). Silicon dioxide is presented in the form of a powder with nanoporous structure of particles and their specific surface of 120 to 400 m2/g.

EFFECT: increasing the strength of the adhesive composition and reducing the consumption of the modifier.

2 dwg, 1 tbl

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RU 2 642 568 C2

Authors

Panov Nikolaj Gennadevich

Pitukhin Aleksandr Vasilevich

Kolesnikov Gennadij Nikolaevich

Vasilev Sergej Borisovich

Dates

2018-01-25Published

2016-03-09Filed