COPPER-CONTAINING SOLUTION FOR PREWASHING YTTRIUM-CONTAINING ELECTROPLATING COMPOSITION TO IMPROVE ANTICORROSION PROTECTION Russian patent published in 2015 - IPC C09D5/44 C09D5/00 C09D163/00 

FIELD: chemistry.

SUBSTANCE: invention relates to a method of electroplating a substrate that has not undergone pretreatment. The method includes (a) contacting at least part of substrate material with a solution containing a copper source and water, where the solution is substantially free of a group IIIB metal source and a group IVB metal source, (b) bringing at least part of the substrate into contact with an electroplating composition containing (i) a film-forming resin and (ii) a yttrium source. Also described is a coated substrate and a method of electroplating a substrate, which includes (a) contacting at least part of substrate material with a solution containing a copper source, water and at least one substance selected from acids and surfactants, followed by contacting at least part of the substrate with an electroplating composition.

EFFECT: corrosion resistance of the substrate material without a compulsory pretreatment step.

20 cl, 9 tbl, 10 ex