FIELD: process engineering.
SUBSTANCE: invention relates to laminar materials for packages, particularly, to production of laminar re-sealing material. This material comprises substrate ply, soldering ply and glue ply arranged there between. Glue ply represents a thermal adhesive or pressure-sensitive glue with shear rate of 10-150 min at 40°C at the load of 1000 g at 40°C on test site of 12.5 mm × 25 mm. Soldering ply comprises PE copolymer ply and, if required, extra PET, PE ply, say, LDPE and/or PP. This process allows application of thermal adhesive or pressure-sensitive glue, then soldering ply in a single process to produce re-sealing laminar material. Said laminar material can be used as a re-sealing cover at, for example, packing pan.
EFFECT: ruled out film separation.
9 cl, 4 dwg
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