FIELD: process engineering.
SUBSTANCE: invention discloses making of relief pattern as a part of laminar structure. Claimed process comprises making the relief pattern on the surface of ply of said structure. Thereafter, protective locking ply is produced in selected areas of said relief pattern. Said protective ply doubles as an underlying relief pattern protector during subsequent structure processing whereat relief is eliminated in areas without said protector ply.
EFFECT: relief pattern as the part of laminar structure.
44 cl, 8 dwg
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