LED LIGHTING DEVICE Russian patent published in 2017 - IPC F21V29/00 

FIELD: lighting.

SUBSTANCE: LED lighting device comprises: an illumination section having a substrate with a plurality of light emitting diode (LED) elements mounted thereon, and a mounting plate which supports the substrate; and a cooling section which cools and supports the mounting plate. Wherein the cooling section comprises: a cooling cylinder with one closed end and the other end closed by the mounting plate; and a coolant filling the cooling cylinder. Wherein the mounting plate has one surface in the direction of its thickness, serving as a mounting surface on which the substrate is fixed, and the other surface in the direction of its thickness, serving as a rear surface; the mounting plate and has: a plurality of separate recesses, each of which is concave in the direction of the mounting surface, formed in a honeycomb structure on the entire back surface disposed within the cooling cylinder; a bottom surface extending between the respective lower surfaces of the plurality of recesses and the mounting surface; and a side surface located between adjacent recesses of the plurality of recesses extending over the mounting surface and the rear surface and separating the plurality of recesses. Wherein one part of the side surface is located on the outer periphery of the rear surface and the other portion of the side surface is centered within the rear surface of the cooling cylinder, and they are connected together. Height of the side surface from the bottom surface of the recesses is made greater than the thickness of the bottom surface, and has a size sufficient to provide the mounting plate rigidity that prevents its deformation by the vapor pressure of the cooling fluid acting on the mounting plate, or by a vacuum state or reduced pressure approximate to vacuum, when the coolant enters the cooling cylinder. Each of LED elements is disposed on the substrate in such way that it is placed within a recess contour opposite to the given LED element via the mounting plate, when it is viewed in the direction of thickness of the mounting plate.

EFFECT: simple configuration, ability to bring thermal resistance to a low level and effectively dissipate heat generated by LED elements.

7 cl, 8 dwg