FIELD: heating system.
SUBSTANCE: conducting layer is located on the cooling surface of the substrate. The cooling surface and the mounting surface are on opposite sides of the substrate. The cooling structure due to the non-magnetic material fluid and the conduit with the fluid are set in thermal contact with the heat-conducting layer.
EFFECT: provision of an integrated electronic module that is compatible with the magnetic resonance environment and that can be made of simple components is achieved by the fact that the integral electronic module contains a substrate with electronic components mounted on the mounting surface of the substrate.
4 cl, 1 dwg
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