ELECTROLYTE FOR DEPOSITING COATING FROM COPPER-INDIUM ALLOY Russian patent published in 2018 - IPC C25D3/58 

FIELD: physics.

SUBSTANCE: invention relates to the field of electroplating, in particular to the electrolytic deposition of a copper-indium alloy, and can be used in instrument engineering and with additional corrosion protection of carbon steels of large-sized units, parts, pipes and other structures. Electrolyte contains copper sulfate, ammonium acetate and water, while it additionally contains hexamethylene diamine succinic acid at the following component ratio, g/l: copper sulfate 20–30; indium sulphate 10–20; ammonium acetate – 20–30; hexamethylenediamine disuccinic acid – 40–50.

EFFECT: use of the proposed electrolyte provides anticorrosion resistance of the coating and increases the ecological safety of the electrolyte and process.

1 cl, 3 ex