ELECTROLYTE FOR DEPOSITION OF COPPER-INDIUM ALLOY Russian patent published in 1999 - IPC

Abstract RU 2134734 C1

FIELD: electrolysises for electrodeposition of copper-indium alloy. SUBSTANCE: electrolyte for deposition of coatings from copper-indium alloy has copper and indium sulfates, trilon B, ammonium acetate and organic additive with definite amounts of components. Electrolyte allows deposition of light, semilustrous coatings with high corrosion resistance. EFFECT: higher efficiency. 1 tbl

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RU 2 134 734 C1

Authors

Povetkin V.V.

Ivanova T.E.

Vedernikova A.V.

Dates

1999-08-20Published

1998-06-02Filed