PASSIVE CONTROL THERMAL CONTROL SYSTEM BASED ON THE CIRCUIT HEAT PIPE FOR COOLING OF PROCESSORS AND PROGRAMMABLE LOGIC INTEGRATED CIRCUITS IN SPACE AND AIRCRAFT ELECTRONIC MODULES AND SERVERS Russian patent published in 2019 - IPC H01L23/36 H01L23/34 H05K7/20 H01L23/427 

FIELD: heating equipment.

SUBSTANCE: invention relates to heat engineering and can be used mainly in cooling systems of electronic components, in particular for cooling of processors and programmable logic integrated circuits in electronic modules and servers of space and aviation applications. Passive thermal control system based on contour heat pipe comprises a frame made from heat-conducting material, installed on motherboard with at least one heat source, made with at least one window for size of heat source in contact with external heat exchanger, and at least one two-phase heat transfer device installed in the frame window, made in the form of a contour heat pipe, including an evaporator with a wick structure inside, providing thermal contact with the heat source, and a condenser, communicating by means of hollow steam line and condensate line with evaporator.

EFFECT: improving heat removal efficiency, providing reliable qualitative thermal contact of heat transfer device simultaneously with heat removing element and cooling object, providing flexibility of a system which enables to use a system with different altitude elements and tolerances for their installation on the motherboard, ensuring stable operation of the thermal control system.

10 cl, 5 dwg, 1 tbl