HEAT REMOVAL CHANNEL OF THE LIQUID COOLING SYSTEM OF RADIOELECTRONIC DEVICES AND A METHOD OF HEAT REMOVAL FROM HEAT LOADED RADIOELECTRONIC DEVICES USING THIS CHANNEL Russian patent published in 2019 - IPC G12B15/02 H05K7/20 

Abstract RU 2694241 C1

FIELD: electronic equipment.

SUBSTANCE: invention relates to design of electronic devices requiring liquid cooling of heat-loaded elements in them. Technical result is achieved by the fact that the heat-removing channel of the liquid cooling system (LCS) is made in the form of a limited cavity, is equipped with inlet (2) and outlet (3) holes and is equipped with a collector of distribution of cooling liquid (4) and partition walls of heat removal zones (7). Collector is made in the form of reservoir fixed in cavity (1) of channel, with holes (5) for supply of cooling liquid to heat removal zones (6). Inlet hole (2) is made in collector, and outlet (3) – in wall, which limits inner cavity of channel. Outlet hole (3) is oriented relative to holes (5). During cooling of heat-loaded elements, cooling liquid is supplied under pressure to collector (4), which from the holes for supply of cooling liquid to heat removal zones (5) in the form of jets falls on the heat removal surface and, by removing heat, flows to the drain zone and through the outlet hole it returns to LCS line. Partition walls of heat removal zones (7) prevent movement of heated liquid on surface of adjacent heat removal zones.

EFFECT: design of a heat removal channel of the liquid-cooling system of radioelectronic devices, which provides efficient cooling of heat-generating elements located along the extended surface.

2 cl, 2 dwg

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RU 2 694 241 C1

Authors

Goldman Aron Kalmanovich

Dates

2019-07-10Published

2018-07-25Filed