FIELD: electronics.
SUBSTANCE: invention relates to cooling fuel elements, in particular, of radio-electronic devices, and can be used for intensive heat removal from microchips or other small-size radio-electronic items installed on printed circuit boards. Achieved by that, in the air cooling device of radioelectronic devices comprising a closed housing accommodating radioelectronic elements installed on radiators, between ribs of which there are parallel channels, and at least one exhaust fan moving air inside the housing the fan is located next to the housing wall located perpendicular to the said channels. On the opposite wall of the housing opposite to each channel there is at least one pair of two parallel slots with the length of not less than 10 mm and the distance between them of not less than 5 mm, herewith a formed by the slots rectangular plate is curved along its long side out of the housing in the form of an arch, and the total size of holes formed by the slots is proportional to the fan power.
EFFECT: technical result is the increase of efficiency of cooling and improved weight and dimension characteristics.
1 cl, 1 dwg
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RU2332818C1 |
