METHOD OF REDUCING SUBSTRATES WITH ELECTROCONDUCTIVE COATING AND LASER CUTTING PATTERN Russian patent published in 2019 - IPC H05B3/86 

FIELD: technological processes.

SUBSTANCE: method of treating substrates (1), wherein a) providing substrate (1) with: - electrically conductive coating (2), - at least one insulating line (3), - at least one first (2.1) and one second partial area (2.2) of coating (2), between which insulation line (3) passes, - optionally at least one defect (3.1) with a fraction of less than 10 % of the total area of insulating line (3), b) first electric contact (4.1) is connected to first partial area (2.1), and second electric contact (4.2) is connected to second partial area (2.2), c) applying voltage U_n between first electric contact (4.1) and second electric contact (4.2), d) measuring whether current flows between first (2.1) and second partial area (2.2), e) if current flows, steps c) and d) are repeated with voltage greater than or equal to U_n, until at step d) current can no longer be measured.

EFFECT: disclosed is a method of reducing substrates with an electroconductive coating and a laser cutting pattern.

14 cl, 9 dwg