FIELD: chemistry.
SUBSTANCE: invention relates to hardeners of epoxy resins and can be used in shipbuilding, nuclear power engineering, oil industry. Hardener for fungus-proof epoxy coatings contains low-molecular polyamide PO-300 in a mixture of solvents and target additives. Low-molecular polyamide PO-300 is taken as 50 wt% solution in a mixture of o-xylene and ethyl cellosolve in weight ratio of 1:1. Target additives are dimethylsulphoxide and trans-beta-nitrostyrene.
EFFECT: invention improves fungus-proofing of obtained anticorrosion polymer coatings based on epoxy resins for special protection of equipment, metal, concrete surfaces and structures, rubber, plastics and composite materials operated in conditions of exposure to biologically damaging agents of the environment.
1 cl, 2 tbl
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Authors
Dates
2020-04-13—Published
2019-09-26—Filed