FIELD: heat transfer.
SUBSTANCE: invention relates to the field of heat transfer. In a known method for reducing the thermal resistance of a two-phase thermosyphon, based on the formation of nano- and microstructures in the evaporator, first grooves are formed on the surface of the evaporator with a depth of 0.1-0.5 mm and a width of 100 to 1000 microns, then the evaporator is fixed and rotated along its axis and applying by evaporation a layer of nanoparticles of aluminum oxide with a size of 10 to 150 nm.
EFFECT: invention is aimed at reducing thermal resistance in two-phase heat pipes and thermosyphons without the use of technologically complex operations.
1 cl, 4 dwg
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