FIELD: various technological processes; chemistry.
SUBSTANCE: invention relates to application of metal coatings by chemical method and is intended for gilding of metallized sections of microelectronics, electronic equipment and radio engineering. Solution for chemical gilding contains, g/l: potassium dicyanoaurate 6–8, citric acid monohydrate 25–40, hydrazine sulphate 50–70, sodium hypophosphite monohydrate 10–12, an accelerating additive in the form of iron (II) sulphate 0.9-1.1, a stabilizing additive in the form of thallium nitrate 0.01–0.1, with molar ratio between hydrazine and hypophosphite reducing agents in range of 1.6:1 to 1.4:1 and pH 4.8–5.2.
EFFECT: invention makes it possible to reduce porosity of chemically deposited gold coatings on electronegative bases at thickness from 1 to 2 mcm and to increase period of stability of solution during holding in the range of working temperatures of gilding process.
1 cl, 2 tbl
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Authors
Dates
2024-03-04—Published
2023-08-01—Filed