FIELD: electronics. SUBSTANCE: photopolymerizing protective coating composition includes 20 to 80 parts by mass epoxy resin mixed ether, 20 to 80 parts by mass oligoether acrylate, 0.5 to 3.0 parts by mass photoinitiator, 0.001 to 0.1 parts by mass hydroquinone, 0.1 to 10 parts by mass Aerosil silica powder, 0.01 to 1.0 parts by mass polymethylsiloxane liquid, 0.01 to 1.0 parts by mass surfactant, 0.2 to 2.0 parts by mass 50-percent aqueous solution of polyethyleneoxide, and 0.03 to 3.0 parts by mass dye. Photocurable composition is prepared by dissolving resin in light-sensitive mixing agent, adding remaining ingredients and then running resultant stock through disperser to obtain homogeneous stock. Further steps are degassing composition and thoroughly admixing it with 50-percent aqueous solution of polyethyleneoxide. EFFECT: improvement and stabilization of thixotropic qualities, betterment of printing qualities and simplification of application technique with preservation of ability to withstand soldering. 2 tbl
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PHOTOPOLYMERIZING COMPOSITION FOR FACE GUARD PRINTING ARRAY MAKING | 1990 |
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PHOTOPOLYMERISABLE COMPOSITION | 0 |
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DRY-FILM PHOTORESIST | 1985 |
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PHOTOSOLIDIFIED COMPOSITION | 0 |
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SU883106A1 |
Authors
Dates
1994-10-15—Published
1988-02-23—Filed