DEVICE FOR AUTOMATICALLY MAINTAINING PARAMETERS OF SOLUTION FOR COPPER PLATING Russian patent published in 1994 - IPC

FIELD: printed circuit board manufacture. SUBSTANCE: in device for automatically maintaining parameters of solution for copper plating a solution sample taken from a bath by a delivery pump is applied into a photocolometric sensor determining the content of two-valence copper ions. Then through different channels of a peristaltic pump a solution sample and hydrochloric acid are simultaneously applied into a mixer made in the form of a liner array of plates the end plates of which are provided with inlet and outlet branch pipes and the remainder are formed with grooves on one of the end-face surfaces and tightly arranged with respect to each other forming chambers being in communication with each other through openings eccentrically located relative to the chambers. EFFECT: enhanced reliability and efficiency. 2 cl, 2 dwg