HEAT-TRANSFER GASKET FOR ISOLATING SEMICONDUCTOR POWER DEVICE FROM HEAT SINK Russian patent published in 1994 - IPC

Abstract RU 2012173 C1

FIELD: electrical engineering. SUBSTANCE: heat-transfer strip is built up of heat-transfer insulating disk made of beryllium oxide and thin-walled metal gaskets in the form of indium disks joined to the former by moulding and spraying method and arranged concentrically. EFFECT: improved efficiency of heat transfer from semiconductor device, facilitated mechanical treatment of surfaces of insulating disk and contacting bus and heat sink. 3 cl, 2 dwg

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RU 2 012 173 C1

Authors

Borisova N.V.

Kotov A.S.

Dates

1994-04-30—Published

1991-07-15—Filed