FIELD: semiconductor devices. SUBSTANCE: semiconductor converter has cooler, semiconductor instruments mounted on it, power supply and control units and output panel. Cooler is manufactured in the form of unit of heat sinks and insulators closed over perimeter to form case of converter to which butts covers are attached to provide for sealing of case. Semiconductor instruments are put on inner surface of heat sinks and have thermal or electric and thermal contact with them. Arrangement of heat sinks and insulators depends on functional diagram of converter. Such design of converter due to combination of unified insulation elements and heat sinks enables power modules to be connected in rigid structure in the form of unit by means of connecting elements for all possible versions of different circuits and simultaneously problem of manufacture of small-dimension converter with high convective heat transfer to be solved. EFFECT: reduced dimensions of converter, effective convective heat transfer. 3 cl, 7 dwg
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Authors
Dates
1995-02-27—Published
1992-02-07—Filed