GLASS FOR SOLDERING WITH MATERIAL OF PLATINUM GROUP Russian patent published in 1994 - IPC

FIELD: electronic and electrovacuum industries. SUBSTANCE: glass for soldering with platinum group materials has, wt.-%: silicon oxide (SiO₂) 32-36; boron oxide (B₂O₃) 0.1-3.0; lead oxide (PbO) 54-61; potassium oxide (K₂O) 0.5-5.0; copper oxide (CuO₂) 0.1-5.0; at least one oxide of the group of arsenic and antimony oxide (As₂O₃) and (Sb₂O₃) 0.3-0.6. Total content of copper oxide and potassium oxide is 3.5-7. Glass properties: soldering temperature is 650-660 C. Output of technological process of encapsulation at diode making is increased by 1.5 time, yield of ready production is increased by 1.2 time. Glass is used for soldering in of silicon diodes. EFFECT: enhanced quality of glass. 1 tbl