FIELD: electronic engineering. SUBSTANCE: hermetic composition has, wt. -% : compound on the basis of low-molecular siloxane rubber 75-96; oligodimethylsiloxane with kinematic viscosity 5-150 mm2/c at 20 C 4-25. Hermetic substance shows enhanced stability of resistance under condition of increased moisture and high-tension voltage. EFFECT: enhanced quality of composition. 2 dwg, 4 tbl
Title | Year | Author | Number |
---|---|---|---|
METHOD OF PRODUCING SEALING COMPOSITION AND COMPOSITION THEREOF | 2011 |
|
RU2472833C1 |
LOW-VISCOSITY SILOXANE COMPOSITION | 2007 |
|
RU2356117C2 |
COMPOSITE POLYMER MATERIAL FOR SEALING | 2020 |
|
RU2745193C1 |
HERMETIC BASED ON LOW-MOLECULE WEIGHT SILOXANE RUBBER | 2006 |
|
RU2307858C1 |
COMPOSITE POLYMER MATERIAL FOR SEALING RADIO-ELECTRONIC PRODUCTS | 2020 |
|
RU2748798C1 |
FILLED POLYMER COMPOSITE MATERIAL | 2017 |
|
RU2686910C2 |
SILICONE COMPOSITION | 2003 |
|
RU2252235C1 |
LOW-MOLECULAR POLYMETHYLSILOXANE RUBBER-BASE COMPOSITION | 0 |
|
SU1120005A1 |
LAW MOLECULAR SILOXANE RUBBER-BASED SEALING COMPOUND | 2003 |
|
RU2249027C1 |
COMPOSITION OF HEAT-CONDUCTING SEALING MATERIAL | 2020 |
|
RU2761621C1 |
Authors
Dates
1995-02-09—Published
1990-09-25—Filed