EPOXIDE POURING COMPOSITION Russian patent published in 1995 - IPC

Abstract RU 2035485 C1

FIELD: moisture protective composition in electronic engineering. SUBSTANCE: pouring composition has, mas. p.: epoxy diane resin 100; iso-methyltetrahydrophthalic anhydride 80-100; oleate sebacate - N,N-diethylamine-3-butoxypropanol-2 2.0=2.5; mixed filler 21.0-31.5 of the following composition, wt.-%: talc 47.4-47.5; mica 47.4-47.5; aerosil 4.6-4.7; titanium 0.3-0.5. EFFECT: increased physico-chemical properties, retained electrophisical indices. 1 tbl

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RU 2 035 485 C1

Authors

Trifonov S.A.

Malkov A.A.

Malygin A.A.

Egorova G.P.

Chugunova N.E.

Shikhanova L.N.

Dates

1995-05-20Published

1992-04-21Filed