FIELD: moisture protective composition in electronic engineering. SUBSTANCE: pouring composition has, mas. p.: epoxy diane resin 100; iso-methyltetrahydrophthalic anhydride 80-100; oleate sebacate - N,N-diethylamine-3-butoxypropanol-2 2.0=2.5; mixed filler 21.0-31.5 of the following composition, wt.-%: talc 47.4-47.5; mica 47.4-47.5; aerosil 4.6-4.7; titanium 0.3-0.5. EFFECT: increased physico-chemical properties, retained electrophisical indices. 1 tbl
Title | Year | Author | Number |
---|---|---|---|
COMPOSITION FOR ANTICORROSIVE COATING | 1992 |
|
RU2041906C1 |
POTTING COMPOSITION | 0 |
|
SU1775431A1 |
PAINT-AND-VARNISH COMPOUND FOR COATING METAL SURFACES | 1990 |
|
RU1750214C |
EPOXY POURING COMPOUND | 1992 |
|
RU2036948C1 |
WATERPROOFING POURING COMPOUND | 1990 |
|
RU1786819C |
INSULATING COMPOSITION | 1992 |
|
RU2044349C1 |
EPOXIDE COMPOSITION | 2001 |
|
RU2222557C2 |
GLUE COMPOSITION | 2005 |
|
RU2285027C1 |
COMPOSITION FOR ANTICORROSIVE COATING | 0 |
|
SU1808000A3 |
METHOD OF PREPARING EPOXY RUBBER COMPOSITIONS | 1992 |
|
RU2063336C1 |
Authors
Dates
1995-05-20—Published
1992-04-21—Filed