FIELD: protection of electronic equipment. SUBSTANCE: compound has, mas. p.: epoxy diane resin 100; bic-(N,N′-dimethylcarbamide)-diphenylmethane 5-8; oligomer or polymer with terminal epoxy groups or dimethyltribromoaniline 10-30; crushed mica 3-20; crushed talc 3-20; silicon dioxide 0.5-5.0 or 70-120; alumina 10-30 or 20-40; silicon dioxide 10-20; titanium dioxide 1-20, and boron nitride 1-20. EFFECT: enhanced quality of compound. 3 tbl
Title | Year | Author | Number |
---|---|---|---|
PROCESS FOR PREPARING MOISTURE-PROTECTIVE SEALING COMPOUND | 1993 |
|
RU2063412C1 |
MOISTURE-PROTECTIVE FILLING COMPOUND | 2013 |
|
RU2552742C2 |
POURING INSULATION COMPOUND | 0 |
|
SU1830074A3 |
THIXOTROPIC COMPOUND | 0 |
|
SU1613459A1 |
COMPOSITION FOR IMPREGNATION, FILLING AND POTTING | 0 |
|
SU1712386A1 |
WATERPROOFING POURING COMPOUND | 1990 |
|
RU1786819C |
POURING COMPOUND | 1992 |
|
RU2039785C1 |
POTTING COMPOSITION | 0 |
|
SU1775431A1 |
COATING COMPOUND | 0 |
|
SU1512996A1 |
ELECTRICAL COMPOUND | 0 |
|
SU1749913A1 |
Authors
Dates
1995-06-09—Published
1992-08-14—Filed