THIN-WIRE BOARD MANUFACTURING PROCESS Russian patent published in 1995 - IPC

FIELD: printed-circuit board manufacture. SUBSTANCE: process involves weaving wire through board, running over with tin and soldering of eyes, deposition of protective layer followed by installation of radio components. Novelty is that before installing radio components adhesive layer of following composition is sprayed: ethyl alcohol - 85-90%; rosin adduct - 2-3%; polyvinylbutyral - 8-13%; adhesive layer is then dried out, polyvinylbutyral film and nonpolymerized glass fabric are placed one after other onto adhesive layer, than board is molded under pressure in barothermostat at vacuum of 10^-1atm and temperature of 160 C for 1.5 h. EFFECT: facilitated procedure. 1 dwg