MICROPACK FOR CHIP MOUNTING Russian patent published in 2008 - IPC H01L23/45 

FIELD: electricity.

SUBSTANCE: invention is attributed to microelectronics and can be used in microelectronic circuits, chip assemblies and microelectronic devices design and manufacturing. Essence of invention: in micropack for chip mounting containing dielectric base with bond areas on upper side connected by means of through metal coating with bond areas on base lower side which represent microwave outputs and protective dielectric coating, through metal coating represents metallised fragments of holes on butt-ends along pack perimeter which also represent microwave outputs. In the centre of one-layer dielectric base through hole is made for chip fitting. In this structure face surfaces of the chip and the base lay in one plane. Hole dimensions exceed chip dimensions not more than by 50 micron at each side. Overall dimensions of the base exceed hole dimensions not more than by 500 micron at each side and chip thickness not more than by 200 micron. This free space of the hole is filled with silver-containing current-conducting adhesive which represents heatspreading base.

EFFECT: improvement of electric, mass and dimensions and heat-dissipating parameters, and ease of handling during mounting and testing of packed chips.

2 dwg