FIELD: automatics. SUBSTANCE: semiconductor module includes semiconductor structures attached to flange base via lower laminated power leads and insulating spacers, upper laminated power leads are attached to structures. Laminated power leads are arranged in one plane with flange base and come out through side surfaces of semiconductor module. EFFECT: facilitated manufacture, reduced production cost. 2 cl, 6 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| POWER SEMICONDUCTOR MODULE | 0 |
|
SU1775754A1 |
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|
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| NO-POTENTIAL POWER MODULE OF ENHANCED INSULATING VOLTAGE | 2004 |
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| SEMICONDUCTOR RECTIFIER | 0 |
|
SU1076984A1 |
