FIELD: power modules for high-voltage converter engineering in various industries, transport, power engineering, and public utilities.
SUBSTANCE: proposed power module that can be built around diodes, thyristors, transistors, and other semiconductor devices has base, leads, case, and cermet board that mounts semiconductor component; arranged in tandem between semiconductor component and base are capacitive voltage divider assembled of minimum two cermet boards interconnected to organize electric circuit set up of minimum two series-connected capacitors and temperature compensator connected through one contacting surface to bottom cermet board and through other one, to module base; dimensions of temperature compensator effective surface follow those of cermet board metal plating contacting this temperature compensator; thickness of the latter should equal at least insulating gap length between edge of bottom board and that of its metal-plated surface.
EFFECT: minimum twice as high insulating voltage between leads and base due to use of internal capacitive voltage divider built around cermet boards.
1 cl, 4 dwg
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Authors
Dates
2006-04-20—Published
2004-01-09—Filed