FIELD: radioelectronic engineering. SUBSTANCE: ferroelectric semiconductor ceramic chip capacitor is rectangular parallelepiped built on semiconductor ferroelectric ceramic plate whose surface is coated with reoxidized dielectric layer of desired thickness. Parallelepiped surface has closed demetallized band, metal electrodes, and contact pads. Parallelepiped has definite proportions of its length, width, and height. Metal electrodes are produced by burning out silver paste or by deposition; they are arranged in center symmetrically in respect to one another on small-area faces of parallelepiped; closed demetallized band is placed across each f small-area faces near contact pads and abuts demetallized side faces of parallelepiped. EFFECT: improved specific volumetric capacity and reduced dielectric power factor. 4 dwg, 2 tbl
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Authors
Dates
1995-11-10—Published
1990-12-07—Filed