FIELD: instrument making and electronic industry. SUBSTANCE: the adhesive composition comprises as diisocyanate an organosilicon oligodiol and 2,4-toluylene diisocyanate adduct of the formula given in the specification, and as oligomeric organosilicon polyol an organosilicon triol of the formula given in the specification. The composition further comprises a tin dialkyl diacylate catalyst, the ratio of the components being as follows (wt parts): 100 adduct; 25-55 organosilicon triol; and 0.001-0.002 catalyst. EFFECT: improved properties of the adhesive composition. 1 tbl
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Authors
Dates
1995-11-20—Published
1992-06-29—Filed