FIELD: copper plating of non-conducting supports of various types such as ceramics, glass or the like. SUBSTANCE: chemical copper plating solution comprises (g/l): 14-16 copper sulfate; 2-4 nickel dichloride; 28-32 trilon; 2-4 sodium carbonate; 18-22 potassium hydroxide; 9-11 ml/l formalin at solution acidity of 12.8-12.9 and temperature of 18-22 C. EFFECT: improved properties of the chemical copper plating solution. 1 tbl
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