PROCESS OF METALLIZING OF DIELECTRICS Russian patent published in 1996 - IPC

Abstract RU 2061096 C1

FIELD: electronics. SUBSTANCE: process of metallizing of dielectrics, predominantly polyimide film, includes deposition of layer of chemical nickel 1.0-2.0 μ thick on it from acidic solution, treatment of deposited layer in 5% solution of nitrogen acidic copper and chemical deposition of copper coat in alkali solution. EFFECT: increased productivity of process. 1 tbl

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RU 2 061 096 C1

Authors

Bessonova E.M.

Kitaev G.A.

Dates

1996-05-27—Published

1990-05-14—Filed