FIELD: electronic engineering. SUBSTANCE: adhesive compound is produced by selecting composition of powder mixture of carbonyl nickel, zirconium, chromium, and copper and its quantity in polymeric binder. EFFECT: improved adhesive properties of compound.
| Title | Year | Author | Number |
|---|---|---|---|
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|
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|
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|
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| ELECTRICALLY CONDUCTIVE ADHESIVE | 0 |
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| SOLDER FOR FLUX-FREE SOLDERING AND METHOD FOR ITS MANUFACTURE | 2015 |
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| POLYMER FRICTION COMPOSITION (VARIANTS) | 1993 |
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| PROCESS OF SOLDERING OF FERRITE ARTICLES | 1992 |
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|
SU1711269A1 |
