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2 076 394

(13)

C1

(51)

IPC

(21) (22)

Application

4949346/07, 1991-06-26

(22)

Actual filing date

1991-06-26

(45)

Published

1997-03-27

(72)

Inventor

Kovalevskij Aleksandr Adamovich[By]

(73)

Holder

Minskij Radiotekhnicheskij Institut

ELECTRICITY CONDUCTING ADHESIVE COMPOUND FOR MOUNTING INTEGRATED CIRCUIT CHIPS Russian patent published in 1997 - IPC

Abstract RU 2076394 C1

FIELD: electronic engineering. SUBSTANCE: adhesive compound is produced by selecting composition of powder mixture of carbonyl nickel, zirconium, chromium, and copper and its quantity in polymeric binder. EFFECT: improved adhesive properties of compound.

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RU 2 076 394 C1

Authors

Kovalevskij Aleksandr Adamovich[By]

Dates

1997-03-27—Published

1991-06-26—Filed

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